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The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
13-15 November 2023
Welcome to Baltimore, USA The 2023 IEEE Future Networks World Forum (FNWF'23) will continue the path set in 2018 by the IEEE 5G World Forum in bringing together experts from industry, academia, and research to exchange their vision as well as their a
Event Ended
USA
Paid
Baltimore